①Secon Production of various kinds of IC burning, testing, aging socket
②Can meet all kinds of low frequency, high frequency, the RF analog signal and digital signal the use of IC
③Cover all kinds of IC packaging forms: such as CSP ，BGA，LGA，mBGA，DIP，PGA，ZIP，PLCC，SOP，PQFP，SQIP，SOIC，QFP，MLF，QFN and so on.。
